Representative Specifications
- Pitch 250/500/1000 µm; Roughness, Transmission with AR, Wafer-Level
Collimating Arrays
Precision collimation at wafer scale for transceiver and silicon-photonics coupling. Tight pitch and surface control, AR-matched, so coupling margin survives production spread.
Applications
- Optical Coupling
- Silicon Photonics Edge Coupling
Custom Project
Need a Custom Datacom Photonic Devices Solution?
Share your target specifications, quantity and timeline. Our team will review the most suitable development and production route.