Representative Specifications
- Ch 4/8/16/32/64, Pitch Accuracy < 0.5 µm, Custom Polish
2D Fiber Arrays
Two-dimensional fiber alignment for co-packaged and multi-channel interconnects. The same sub-micron discipline as 1D arrays, extended into 2D formats for dense photonic packaging.
Applications
- Photonic Packaging
- Multi-Channel Optical Interconnects
Custom Project
Need a Custom Datacom Photonic Devices Solution?
Share your target specifications, quantity and timeline. Our team will review the most suitable development and production route.